Experimental study of density, surface tension, and contact angle of Sn-Sb-based alloys for high temperature soldering

The density and the surface tension of binary Sn-Sb and ternary Sn-Sb-Cu liquid alloys have been measured over a wide temperature range by the sessiledrop method. The experimental data for the surface tension were analyzed by the Butler thermodynamic model. Investigations of the wetting behavior of these alloys on the Cu and Ni substrates in a vacuum were also performed.