Investigation of silicon MEMS structures subjected to thermal loading by digital holography

In this paper we study silicon MEMS (Microelectromechanical systems) structures subjected to thermal loading. Digital holography has been investigated as inspection tool to evaluate the deformation induced by the thermal loading. Application of DH on structures with several different geometries and shapes, like cantilever beams, bridges and membranes is reported and result will be discussed. Dimensions of the inspected microstructures, varies in the range 1÷50µm. The experimental results shown that a "bimorph-effect" induces a deformation in MEMS structures. The difficulties encountered in performing the deformation analysis by digital holography in real-time will be afforded and discussed. A method with automatic focus tracking in Digital Holography is proposed allowing inspection of MEMS, under thermal loading, in real-time.