Electrical and structural properties of Ti/Al-based contacts on AlGaN/GaN heterostructures with different quality

In this work, the electrical and structural properties of Ti/Al contacts on AlGaN/GaN heterostructures with a different crystalline quality were investigated. In particular, the sample with a lower defects density required a higher temperature (800 degrees C) to obtain Ohmic contacts, while the more defective sample showed Ohmic behaviour at lower annealing temperature (500 degrees C). The susceptibility to oxidation of the metal stack upon annealing has been monitored by chemical analyses. Moreover, the temperature dependence of the contact resistance of the Ti/Al annealed contacts revealed that the interface current transport mechanism depends on the material quality. These results were attributed to the presence of V-shaped defect close to the surface of the AlGaN barrier layer. A nanoscale electrical analysis demonstrated a preferential current conduction through these defects, which indeed plays a relevant role for the formation of the Ohmic contact.