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A Self-Annealing Technique for Simultaneous Titanium Silicide and N+/P Junction Formation

Contributo in Atti di convegno
Data di Pubblicazione:
1985
Abstract:
ABSTRACT ABSTRACT- P+ self-annnealing implantations through evaporated Ti is performed to simultaneously form the silicide and the junction underneath, avoiding the need for further post-implantation thermal treatments. The formation of the TiSi2, phase and the good quality of the silicon-silicide interface are observed, when operating at power densities <= 16 W/cm2. Deep phosphorus distributions extending below the silicide down to 480รท600 nm are obtained.
Tipologia CRIS:
04.01 Contributo in Atti di convegno
Keywords:
ion implantion; self-annealing; silicon
Elenco autori:
Lulli, Giorgio; Nipoti, Roberta
Link alla scheda completa:
https://iris.cnr.it/handle/20.500.14243/217597
Titolo del libro:
Ion Beam Processes in Advanced Electronic Materials and Device Technology
Pubblicato in:
MRS PROCEEDINGS
Series
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URL

http://journals.cambridge.org/article_S1946427400511993
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