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Indium in silicon: a study on diffusion and electrical activation

Contributo in Atti di convegno
Data di Pubblicazione:
2003
Abstract:
In this work we investigate the diffusion and the electrical activation of In atoms implanted in silicon with different energies, in the range 80-360 keV, after rapid thermal processing. Our investigation shows a clear dependence of In out-diffusion and electrical activation on the implant depth, being the electrically active fraction higher with increasing the implant energy for a fixed dose. The data are explained considering the balance between the local In concentration and the C background inside the silicon substrate and the formation of C-In complexes, which play a role in the enhanced electrical activation due to the shallower level they introduce into the Si band gap (E-nu + O. 111 eV), with respect to the rather deep level (E-nu + O. 156 eV) of In alone. In and C co-implantation has also been studied within this work, in order to confirm the key role of C in the increase of the electrical activation. A large increase of the electrical activation has been detected in the co-implanted samples, up to a factor of about 8 after annealing at 900degreesC. However, C precipitation occurs at 1100degreesC, with dramatic effects on the carrier concentration.
Tipologia CRIS:
04.01 Contributo in Atti di convegno
Keywords:
ACCEPTOR LEVEL; DOPED SILICON; CARBON
Elenco autori:
Privitera, Vittorio; LA MAGNA, Antonino; Mannino, Giovanni; Scalese, Silvia; Solmi, Sandro
Autori di Ateneo:
LA MAGNA ANTONINO
MANNINO GIOVANNI
PRIVITERA VITTORIO
SCALESE SILVIA
Link alla scheda completa:
https://iris.cnr.it/handle/20.500.14243/72990
Titolo del libro:
CMOS FRONT-END MATERIALS AND PROCESS TECHNOLOGY Book Series: MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS
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