Burst mode versus single-pulse machining for Bessel beam micro-drilling of thin glass: study and comparison

We present a study on the micro-drilling process by means of a picosecond Bessel-Gauss beam, and the achievements obtained on a 200-mu m-thick AF32 glass sample in different laser fabrication regimes. In particular, we compare the results and morphology of the holes generated with a high-repetition-rate pulsed laser, respectively, in the single-pulse mode and in the burst mode machining regimes. We highlight the advantages or drawbacks of these two types of microfabrication for the generation of through-holes. For a given pulse density, the burst mode turns out to be advantageous with respect to the single-pulse mode fabrication in terms of lower energy per pulse needed and higher speed of drilling, even if the stronger thermal effects can more easily lead to surface cracks. On the other hand, by adjusting the pulse density below a critical level, it can be shown that the single-pulse regime can be adopted for the generation of more regular through-holes and cleaner apertures, even if multiple pass operation is likely to be needed.