Towards the Automated Coverlay Assembly in FPCB Manufacturing: Concept and Preliminary Tests

In modern electronics, flexible and rigid-flex PCBs are largely used due to their intrinsic versatility and performance, allowing to increase the available volume, or enabling connection between unconstrained components. Rigid-flex PCBs consists of rigid board portions with flexible interconnections and are commonly used in a wide variety of industrial applications. However, the assembly process of these devices still has some bottlenecks. Specifically, they require the application of cover layers (namely, coverlays), to provide insulation and protection of the flexible circuits. Due to the variability in planar shape and dimensions, the coverlay application is still performed manually, requiring troublesome manipulation steps and resulting in undetermined time-cycle and precision.