Perspectives and advantages of the use of excimer laser annealing for MOS technology

The integration of excimer laser annealing (ELA) into the MOS device technology has been studied and evaluated within the frame of the IST project FLASH (Fundamentals and applications of laser processing for highly innovative MOS technology), funded by the European Commission. The final aim of the project was to demonstrate that ELA can be applied as a reliable, effective and advantageous process in the context of semiconductor device fabrication. Some of the results of this activity are summarised, relative to the experimental characterization and theoretical modelling. The electrical characterization of the transistor fabricated by ELA is also presented, showing a device yield of 90% on wafer.