Low noise performances of scalable sub-quarter-micron GaN HEMT with Field Plate technology

In this work an innovative GaN HEMT technology based on a scalable Gate Length (80nm, 150nm and 250nm) process with complementary integration of a Schottky Field Plate (FP) is presented. The characterization results are compared between different Gate Lengths and FP topologies configurations, fabricated on the same wafer. In particular, remarkable low noise performances (NF=0.87dB, G=10.5dB @ 10GHz) have been measured with an L=250nm device without FP, while with the additional FP protection a minimum NF=1.5dB and G=13.5dB have been reached.