Electromigration feedback controlled Nanogaps fabrication based on MPTMS adhesion layer

Nanogap devices are useful in several applications and together with other novel solutions represent interesting approaches to find new technologies to solve the limitation of CMOS processes. They can be used in molecular electronics, but also in sensor devices, exploiting nano-structures to detect molecules having comparable dimensions. Present work is devoted to fabrication of nanogaps using gold probes and Electromigration Induced Break Junction (EIBJ) technique. To produce the two terminal probes where to build the nanogap on silicon surface, a self assembly adhesion molecule (3-Mercaptopropyl)trimethoxysilane is used. This molecule solves the problem of using metallic adhesion layers for gold deposition, like titanium or chromium. Analysis on produced nanogaps has been carried out, while studying in particular the combined effects of temperature and electromigration.