FDTD Modeling of Void Defects in VLSI Interconnection

Conference Paper

Publication Date:

2002

Iris type:

04.01 Contributo in Atti di convegno

Keywords:

FDTD; electromigration; simulation

List of contributors:

Scorzoni, Andrea; Impronta, MAURIZIO PIO

Handle:

https://iris.cnr.it/handle/20.500.14243/69319