Molybdenum armour layer on Copper plates, manufacturing technologies and tests of prototypes
Abstract
Publication Date:
2011
abstract:
In the framework of the activities for the development of the Neutral Beam Injector (NBI) for
ITER, the design of the Radio-Frequency plasma source has been carried out. The most critical
components of the plasma source are the rear vertical plates facing the plasma, since they are hit
by the back-streaming positive ions that are generated, mostly for stripping losses, inside the 1
MV electrostatic accelerator. As result of the physics-optical analyses carried out on the
accelerator, the number and energy spectrum of the back accelerated positive ions are known, so
it was possible to estimate the sputtering rate and the power density profile on the impinged
surfaces of the plasma source. As a consequence, the need of an armour layer having low
sputtering yield was established to be necessary. Molybdenum and Tungsten are the most
suitable materials; nevertheless the minimum required thickness is approximately 0.5mm.
Among the few technologies suitable for the manufacturing of such thick armour layer,
according to the strict technical requirements and with a quite complex geometry, plasma
spraying and explosion bonding techniques have been investigated. The explosion bonding
process has been found indeed to be the most promising. In the paper the activities carried out for
optimizing the explosion bonding process of molybdenum on copper and the forming of the
samples according to the final components specifications are presented. The resulting prototypes
made by explosion bonding and the sample obtained by plasma spraying have then been tested:
microscopic, outgassing, delamination, thermal shock, and thermal fatigue analyses have been
carried out. The results of the tests are presented in this paper, giving an overview on the critical
technological aspects and on the still open issues in view of the manufacturing of the final
components.
Iris type:
04.02 Abstract in Atti di convegno
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