Diffusion bonding in metallic systems

The Diffusion bonding is a solid-state joining process capable to bond all materials whose chemical and metallurgical properties are compatible. The method is based on the use of some metal deposited on a metallic substrate inducing by diffusion the local formation of a low melting point alloy. The coalescence of contacting surfaces is produced with minimum macroscopic deformation by diffusion controlled processes, which are induced by applying heat and pressure for a finite interval. In this work a short presentation of theoretical results on the diffusion bonding in some metallic systems is given. Dissolution, growth and chemical solid phase diffusion are kinetic processes involved in the joining of similar materials. The joint formation is dependent on a number of parameters, in particular, time, bonding temperature, mutual solubility, diffusion rates of the diffusing components, applied pressure, and method of heat application. The computed results of simulation of diffusion-controlled, two-phase, moving interface problems are compared with the results reported in the literature.