Publication Date:
2020
abstract:
This work has investigated the impact of crystallographic structure on SnAgCu (SAC) solder reliability at print board circuit (PCB) level. A detailed reliability analysis has been performed on packages with different solder thickness. The correlation between experiments and Finite Element Model results explains how NiAu metallization and the reduction of solder thickness improve the solder joint reliability performances.
Iris type:
04.01 Contributo in Atti di convegno
Keywords:
Reliability; Soldering; Stress; Optical imaging; Scanning electron microscopy; Finite element analysis; Lead
List of contributors: