Effects of alloying elements on interface and properties of C/Cu composites

The preparation of novel C/Cu composites by controlled three-step electrodeposition is described. Alloying elements, i.e., Sn, Cr, Fe and Ni were added to the systems to modify the interface. The properties of the interfaces were extensively studied. The interface interaction in C/Cu composites was mechanical bonding, and chemical bonding in C/Cu-Cr and C/CuFe composite systems. Alloying elements can improve the tensile strength of composites by enhancing the interface bonding. An improved thermal compatibility of the composites was observed.