Preparation and thermal characterization of Carbon Nanotubes-based composites for applications in electronics packaging
Conference Paper
Publication Date:
2008
abstract:
The thermal resistance of nanocomposite layers formed by Single Wall Carbon Nanotubes (SWCNT) dispersed in epoxy resins has been measured under conditions similar to the ones used to dissipate heat in microelettronic devices. The variation of thermal conductivity as a function of concentration of SWCNT is reported and discussed with reference to the dispersion state of SWCNT in the layers. © 2008 IEEE.
Iris type:
04.01 Contributo in Atti di convegno
Keywords:
Carbon nanotubes; Epoxy resin; Nanocomposite; Thermal interface materials; Thermal management; TIM
List of contributors: