Silicon as a Phase Change Material: Performance of h-BN Ceramic During Multi-Cycle Melting/Solidification of Silicon

Silicon has recently been recognized as a potentially attractive phase change material for ultra-high-temperature latent heat thermal energy storage (LHTES) and conversion systems. It has been proposed that the utilization of silicon's latent heat should drastically increase the performance of LHTES devices in terms of operational temperatures and available energy density. Nevertheless, in order to ensure a high reliability and long lifetime of the system, proper ceramic materials that are able to withstand contact heating and cooling cycles during consecutive melting/solidification steps need to be examined and selected. Previously, we have documented that hexagonal boron nitride (h-BN) is the only ceramic that shows non-wettability and limited reactivity in contact with molten silicon at temperatures up to 1650 degrees C. In this work, we present for the first time the results of experimental research on the performance of a Si/h-BN system upon cycling melting/solidification processes. For this reason, the Si/h-BN couple was subjected to a sessile drop experiment containing 15 cycles of heating/cooling between 1300 degrees C and 1450 degrees C. During the test, temperatures of specific events as well as contact angle values were recorded. After the test, the structure and surface morphology of the solidified Si/h-BN couple were characterized by means of scanning electron microscopy.