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Effects of hydrogen implantation temperature on InP surface blistering

Articolo
Data di Pubblicazione:
2008
Abstract:
We have investigated the effects of hydrogen implantation temperature on the ion-cut process of InP by examining the correlation between surface blistering and the ion induced damage, hydrogen distribution, and strain. Using Rutherford backscattering spectrometry, elastic recoil detection, and x-ray diffraction, it was found that both the point defects induced by the hydrogen implantation and the in-plane compressive stress were necessary for hydrogen trapping and H-platelet nucleation and growth. The control of implantation temperature is crucial for creating sufficient defects and strain to induce surface blistering or layer exfoliation. (C) 2008 American Institute of Physics.
Tipologia CRIS:
01.01 Articolo in rivista
Keywords:
SILICON; DAMAGE; SEMICONDUCTORS
Elenco autori:
Grimaldi, MARIA GRAZIA; Bruno, Elena
Link alla scheda completa:
https://iris.cnr.it/handle/20.500.14243/121588
Pubblicato in:
APPLIED PHYSICS LETTERS
Journal
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