The role of the sapphire nitridation temperature on the gan growth by Plasma-assisted Molecular Beam epitaxy: Part II. The interplay between chemistry and structure of layers

The effect of sapphire nitridation temperature on the chemistry and microstructure of the sapphire substrate/GaN interface, nucleation layer, and of the GaN epilayers grown by rf plasma assisted molecular beam epitaxy is investigated. It is found that a sapphire nitridation temperature as low as 200 °C improves the structural and optical quality of GaN epilayers. This result can be explained by the chemistry of the sapphire nitridation process, which is discussed in the framework of a model considering the competitive formation of AlN and oxynitride (NO). In particular, at 200 °C, NO desorbs from the sapphire surface, yielding an homogeneous 6 Å AlN layer upon N2 plasma nitridation. This low temperature AlN template favors the nucleation of hexagonal GaN nuclei which coalesce completely resulting in a hexagonal GaN buffer layer that homogeneously covers the sapphire substrate. This condition promotes the growth of a high quality GaN epilayer. In contrast, high nitridation temperatures result in a mixed AlN/NO nitrided sapphire surface which induce a perturbed and more defected interface with the occurrence of cubic crystallites in the GaN buffer. A sapphire surface with random GaN islands is found upon annealing of the GaN buffer and this condition results in a low-quality GaN epilayer. © 2002 American Institute of Physics. @DOI: 10.1063/1.1435835#