Publication Date:
2002
abstract:
Plasma treatments are widely used in microelectronic industry, but they may
leave some residual passivated damage in the gate oxides at the end of the
processing. The plasma-induced damage can be amplified by metal
interconnects (antenna) attached to the gate during the plasma treatments.
Ionising radiation reactivates this latent damage, which produces enhanced
oxide charge and Si/SiO2 interface state density. Two CMOS technologies
have been investigated, with 5 and 7 nm gate oxides. Threshold voltage
shifts, transconductance decrease, and interface traps build-up are always
larger for plasma damaged devices than for reference devices.
Iris type:
01.01 Articolo in rivista
List of contributors:
Fuochi, Piergiorgio
Published in: