Ultra-shallow junction formation by excimer laser annealing and low energy (<1 kev) B implantation: a two-dimensional analysis

Formation of shallow junctions has been investigated by using excimer laser annealing in combination with two implantation schemes: BF2-ions at 20 keV and B-ions at low energies (<1 keV). The latter approach was shown to produce best results, with ultra-shallow pro.les extending to a depth as low as 35 nm. The lateral distribution of the implanted B following laser annealing has been studied with two-dimensional measurements using selective etching and cross-section transmission electron microscopy (TEM) on samples where the implanted dopant was con.ned within an oxide mask. The results show that there is substantial lateral di.usion of B under the oxide mask when melting occurs in this region while, if melting under the oxide mask is prevented, the implanted B close to the oxide mask edge was not activated by laser annealing. The results have been explained by numerical heat-flow calculations and it is concluded that the melting of the Si under the masked region and, therefore, the lateral di.usion, can be controlled by the oxide mask thickness.