Data di Pubblicazione:
2012
Abstract:
Interfacial reactions in the Sb-Sn/Cu and Sb-Sn/Ni systems have been investigated by means of wetting
experiments. The wetting behaviour of two lead-free alloys, namely, Sb2.5Sn97.5 and Sb14.5Sn85.5 (at.%), in
contact with Cu and Ni-substrates has been studied in view of possible applications as high-temperature
solders in the electronics industry. The contact angle measurements on Cu and Ni plates were performed
by using a sessile drop apparatus. The solder/substrate interface was characterised by the SEM-EDS
analyses.
experiments. The wetting behaviour of two lead-free alloys, namely, Sb2.5Sn97.5 and Sb14.5Sn85.5 (at.%), in
contact with Cu and Ni-substrates has been studied in view of possible applications as high-temperature
solders in the electronics industry. The contact angle measurements on Cu and Ni plates were performed
by using a sessile drop apparatus. The solder/substrate interface was characterised by the SEM-EDS
analyses.
Tipologia CRIS:
01.01 Articolo in rivista
Keywords:
Alloys; Interfaces; Metals; Solidification; Electron microscopy
Elenco autori:
Lanata, Tiziana; Novakovic, Rada
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